R7FA6M5BH2CBM#BC0 Renesas Electronics Corporation

Description: MCU:RA, Packaging: Tray, Package / Case: 144-LFBGA, Mounting Type: Surface Mount, Speed: 200MHz, Program Memory Size: 2MB (2M x 8), RAM Size: 512K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 8K x 8, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 25x12b SAR; D/A 2x12b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V, Peripherals: Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT, Supplier Device Package: 144-LFBGA (7x7), Number of I/O: 109.