Produktrezensionen
Produktbewertung abgeben
Technische Details RASW.015 100G Chip Quik
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN, Packaging: Bulk, Diameter: 0.015" (0.38mm), Wire Gauge: 27 AWG, 28 SWG, Composition: Sn63Pb37 (63/37), Type: Wire Solder, Melting Point: 361°F (183°C), Form: Spool, 3.53 oz (100g), Process: Leaded, Flux Type: Rosin Activated (RA), Shelf Life Start: Date of Manufacture, Shelf Life: 60 Months.
Weitere Produktangebote RASW.015 100G nach Preis ab 29.98 EUR bis 29.98 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
 |
RASW.015 100G | Chip Quik Inc. |
 Description: SOLDER WIRE 63/37 TIN/LEAD ROSINPackaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
|
| RASW.015 100G |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.98 EUR |