RASW.015 100G Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 25.2 EUR |
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Technische Details RASW.015 100G Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN, Packaging: Bulk, Diameter: 0.015" (0.38mm), Wire Gauge: 27 AWG, 28 SWG, Composition: Sn63Pb37 (63/37), Type: Wire Solder, Melting Point: 361°F (183°C), Form: Spool, 3.53 oz (100g), Process: Leaded, Flux Type: Rosin Activated (RA), Shelf Life Start: Date of Manufacture, Shelf Life: 60 Months.