RASW.020 1LB Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 64.24 EUR |
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Technische Details RASW.020 1LB Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN, Packaging: Bulk, Diameter: 0.020" (0.51mm), Wire Gauge: 24 AWG, 25 SWG, Composition: Sn63Pb37 (63/37), Type: Wire Solder, Melting Point: 361°F (183°C), Form: Spool, 1 lb (454 g), Process: Leaded, Flux Type: Rosin Activated (RA).