RE471 ROTH ELEKTRONIK
Hersteller: ROTH ELEKTRONIKDescription: ROTH ELEKTRONIK - RE471 - Multiadapter, SMD, FR4, Epoxidglas, 1.5mm, 57.2mm x 57.2mm
tariffCode: 85366990
Umwandlung zu: -
productTraceability: No
rohsCompliant: YES
Rastermaß: 2.54mm
Umwandlung von: -
euEccn: NLR
hazardous: false
Reihenabstand: 2.54mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: -
SVHC: No SVHC (10-Jun-2022)
auf Bestellung 3 Stücke:
Lieferzeit 14-21 Tag (e)
Produktrezensionen
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Technische Details RE471 ROTH ELEKTRONIK
Category: Universal PCBs, Description: Board: universal; multiadapter; W: 57.2mm; L: 57.2mm, Type of board: universal, Board variant: multiadapter, Width: 57.2mm, Length: 57.2mm, Soldering pads configuration: QFP24; QFP32; QFP40; QFP44; QFP48; QFP52; QFP64; QFP80; QFP100; QFP108; QFP112; QFP120; QFP128; QFP132; QFP144, Soldering pads pitch: 0.5/0.65mm, Kind of board clad: gold plated soldering pads, Kind of material: fiber glass reinforced, Material: epoxy resin; FR4, Laminate thickness: 1.5mm, Copper plating thickness: 35µm, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote RE471
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RE471 | Hersteller : ROTH ELEKTRONIK GMBH |
Category: Universal PCBs Description: Board: universal; multiadapter; W: 57.2mm; L: 57.2mm Type of board: universal Board variant: multiadapter Width: 57.2mm Length: 57.2mm Soldering pads configuration: QFP24; QFP32; QFP40; QFP44; QFP48; QFP52; QFP64; QFP80; QFP100; QFP108; QFP112; QFP120; QFP128; QFP132; QFP144 Soldering pads pitch: 0.5/0.65mm Kind of board clad: gold plated soldering pads Kind of material: fiber glass reinforced Material: epoxy resin; FR4 Laminate thickness: 1.5mm Copper plating thickness: 35µm Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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RE471 | Hersteller : ROTH ELEKTRONIK GMBH |
Category: Universal PCBs Description: Board: universal; multiadapter; W: 57.2mm; L: 57.2mm Type of board: universal Board variant: multiadapter Width: 57.2mm Length: 57.2mm Soldering pads configuration: QFP24; QFP32; QFP40; QFP44; QFP48; QFP52; QFP64; QFP80; QFP100; QFP108; QFP112; QFP120; QFP128; QFP132; QFP144 Soldering pads pitch: 0.5/0.65mm Kind of board clad: gold plated soldering pads Kind of material: fiber glass reinforced Material: epoxy resin; FR4 Laminate thickness: 1.5mm Copper plating thickness: 35µm |
Produkt ist nicht verfügbar |