RE471

RE471 ROTH ELEKTRONIK


317674.pdf Hersteller: ROTH ELEKTRONIK
Description: ROTH ELEKTRONIK - RE471 - Multiadapter, SMD, FR4, Epoxidglas, 1.5mm, 57.2mm x 57.2mm
tariffCode: 85366990
Umwandlung zu: -
productTraceability: No
rohsCompliant: YES
Rastermaß: 2.54mm
Umwandlung von: -
euEccn: NLR
hazardous: false
Reihenabstand: 2.54mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: Multicomp Pro RJ45 Adapter
SVHC: No SVHC (10-Jun-2022)
auf Bestellung 3 Stücke:

Lieferzeit 14-21 Tag (e)
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Technische Details RE471 ROTH ELEKTRONIK

Category: Universal PCBs, Description: Board: universal; multiadapter; W: 57.2mm; L: 57.2mm, Type of board: universal, Board variant: multiadapter, Material: epoxy resin; FR4, Laminate thickness: 1.5mm, Width: 57.2mm, Length: 57.2mm, Copper plating thickness: 35µm, Kind of board clad: gold plated soldering pads, Soldering pads configuration: QFP24; QFP32; QFP40; QFP44; QFP48; QFP52; QFP64; QFP80; QFP100; QFP108; QFP112; QFP120; QFP128; QFP132; QFP144, Soldering pads pitch: 0.5/0.65mm, Kind of material: fiber glass reinforced, Anzahl je Verpackung: 1 Stücke.

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RE471 RE471 Hersteller : ROTH ELEKTRONIK GMBH re471.pdf Category: Universal PCBs
Description: Board: universal; multiadapter; W: 57.2mm; L: 57.2mm
Type of board: universal
Board variant: multiadapter
Material: epoxy resin; FR4
Laminate thickness: 1.5mm
Width: 57.2mm
Length: 57.2mm
Copper plating thickness: 35µm
Kind of board clad: gold plated soldering pads
Soldering pads configuration: QFP24; QFP32; QFP40; QFP44; QFP48; QFP52; QFP64; QFP80; QFP100; QFP108; QFP112; QFP120; QFP128; QFP132; QFP144
Soldering pads pitch: 0.5/0.65mm
Kind of material: fiber glass reinforced
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
RE471 RE471 Hersteller : ROTH ELEKTRONIK GMBH re471.pdf Category: Universal PCBs
Description: Board: universal; multiadapter; W: 57.2mm; L: 57.2mm
Type of board: universal
Board variant: multiadapter
Material: epoxy resin; FR4
Laminate thickness: 1.5mm
Width: 57.2mm
Length: 57.2mm
Copper plating thickness: 35µm
Kind of board clad: gold plated soldering pads
Soldering pads configuration: QFP24; QFP32; QFP40; QFP44; QFP48; QFP52; QFP64; QFP80; QFP100; QFP108; QFP112; QFP120; QFP128; QFP132; QFP144
Soldering pads pitch: 0.5/0.65mm
Kind of material: fiber glass reinforced
Produkt ist nicht verfügbar