RE933-03 Roth Elektronik


de_RE933-03.pdf?2025.01
Hersteller: Roth Elektronik
Description: SMD Adapter TSSOP16 0 65
Packaging: Bulk
Size / Dimension: 4.73" L x 2.32" W (120.10mm x 58.90mm)
Pitch: 0.026" (0.65mm)
Board Thickness: 0.059" (1.50mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
auf Bestellung 165 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+10.33 EUR
10+10.16 EUR
25+10.04 EUR
50+9.8 EUR
100+9.62 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details RE933-03 Roth Elektronik

Category: Universal PCBs, Description: Board: universal; multiadapter; W: 13.5mm; L: 23.5mm; TSSOP16, Material: epoxy resin; fiberglass; FR4, Kind of board clad: gold plated soldering pads, Board variant: multiadapter, Soldering pads configuration: TSSOP16, Type of board: universal, Copper plating thickness: 35µm, Laminate thickness: 1.5mm, Width: 13.5mm, Length: 23.5mm.

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RE933-03 RE933-03 ROTH ELEKTRONIK GMBH re933-03.pdf Category: Universal PCBs
Description: Board: universal; multiadapter; W: 13.5mm; L: 23.5mm; TSSOP16
Material: epoxy resin; fiberglass; FR4
Kind of board clad: gold plated soldering pads
Board variant: multiadapter
Soldering pads configuration: TSSOP16
Type of board: universal
Copper plating thickness: 35µm
Laminate thickness: 1.5mm
Width: 13.5mm
Length: 23.5mm
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
RE933-03 re933-03.pdf
Hersteller: ROTH ELEKTRONIK GMBH
Category: Universal PCBs
Description: Board: universal; multiadapter; W: 13.5mm; L: 23.5mm; TSSOP16
Material: epoxy resin; fiberglass; FR4
Kind of board clad: gold plated soldering pads
Board variant: multiadapter
Soldering pads configuration: TSSOP16
Type of board: universal
Copper plating thickness: 35µm
Laminate thickness: 1.5mm
Width: 13.5mm
Length: 23.5mm
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH