
RS31317AR Reed Semiconductor Corp.

Description: IC ELECTRONIC FUSE 26LGA
Features: Latched Fault
Packaging: Tape & Reel (TR)
Package / Case: 26-WFLGA Exposed Pad
Mounting Type: Surface Mount
Type: Hot Swap Controller
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 16V
Applications: Motherboard
Internal Switch(s): Yes
Current - Output (Max): 15A
Supplier Device Package: 26-LGA (4x4)
Programmable Features: Current Limit
Number of Channels: 1
Current - Supply: 15 A
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
5000+ | 2.76 EUR |
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Technische Details RS31317AR Reed Semiconductor Corp.
Description: IC ELECTRONIC FUSE 26LGA, Features: Latched Fault, Packaging: Tape & Reel (TR), Package / Case: 26-WFLGA Exposed Pad, Mounting Type: Surface Mount, Type: Hot Swap Controller, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 4.5V ~ 16V, Applications: Motherboard, Internal Switch(s): Yes, Current - Output (Max): 15A, Supplier Device Package: 26-LGA (4x4), Programmable Features: Current Limit, Number of Channels: 1, Current - Supply: 15 A.
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RS31317AR | Hersteller : Reed Semiconductor Corp. |
![]() Features: Latched Fault Packaging: Cut Tape (CT) Package / Case: 26-WFLGA Exposed Pad Mounting Type: Surface Mount Type: Hot Swap Controller Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 16V Applications: Motherboard Internal Switch(s): Yes Current - Output (Max): 15A Supplier Device Package: 26-LGA (4x4) Programmable Features: Current Limit Number of Channels: 1 Current - Supply: 15 A |
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