RS31317AR

RS31317AR Reed Semiconductor Corp.


RS31317A%20ABRIDGED%20DATA%20SHEET.pdf Hersteller: Reed Semiconductor Corp.
Description: IC ELECTRONIC FUSE 26LGA
Features: Latched Fault
Packaging: Tape & Reel (TR)
Package / Case: 26-WFLGA Exposed Pad
Mounting Type: Surface Mount
Type: Hot Swap Controller
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 16V
Applications: Motherboard
Internal Switch(s): Yes
Current - Output (Max): 15A
Supplier Device Package: 26-LGA (4x4)
Programmable Features: Current Limit
Number of Channels: 1
Current - Supply: 15 A
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Technische Details RS31317AR Reed Semiconductor Corp.

Description: IC ELECTRONIC FUSE 26LGA, Features: Latched Fault, Packaging: Tape & Reel (TR), Package / Case: 26-WFLGA Exposed Pad, Mounting Type: Surface Mount, Type: Hot Swap Controller, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 4.5V ~ 16V, Applications: Motherboard, Internal Switch(s): Yes, Current - Output (Max): 15A, Supplier Device Package: 26-LGA (4x4), Programmable Features: Current Limit, Number of Channels: 1, Current - Supply: 15 A.

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RS31317AR RS31317AR Hersteller : Reed Semiconductor Corp. RS31317A%20ABRIDGED%20DATA%20SHEET.pdf Description: IC ELECTRONIC FUSE 26LGA
Features: Latched Fault
Packaging: Cut Tape (CT)
Package / Case: 26-WFLGA Exposed Pad
Mounting Type: Surface Mount
Type: Hot Swap Controller
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 16V
Applications: Motherboard
Internal Switch(s): Yes
Current - Output (Max): 15A
Supplier Device Package: 26-LGA (4x4)
Programmable Features: Current Limit
Number of Channels: 1
Current - Supply: 15 A
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH