SA083040 On Shore Technology Inc.
Hersteller: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Thermoplastic, Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 80.0µin (2.03µm)
Contact Material - Post: Brass
Part Status: Active
| Anzahl | Preis |
|---|---|
| 24+ | 0.74 EUR |
| 29+ | 0.63 EUR |
| 30+ | 0.59 EUR |
| 50+ | 0.56 EUR |
| 100+ | 0.53 EUR |
| 250+ | 0.5 EUR |
| 500+ | 0.48 EUR |
| 1000+ | 0.45 EUR |
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Technische Details SA083040 On Shore Technology Inc.
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Thermoplastic, Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 80.0µin (2.03µm), Contact Material - Post: Brass, Part Status: Active.