SA183040 On Shore Technology Inc.
Hersteller: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 80.0µin (2.03µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic, Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -40°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
| Anzahl | Preis |
|---|---|
| 12+ | 1.55 EUR |
| 14+ | 1.31 EUR |
| 26+ | 1.23 EUR |
| 52+ | 1.17 EUR |
| 104+ | 1.11 EUR |
| 260+ | 1.04 EUR |
| 520+ | 0.99 EUR |
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Technische Details SA183040 On Shore Technology Inc.
Description: CONN IC DIP SOCKET 18POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 80.0µin (2.03µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Thermoplastic, Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -40°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.