SAM9X75D2G-I/4TB Microchip Technology
Hersteller: Microchip TechnologyMicroprocessors - MPU ARM926 MPU,2Gbit DDR3L,MIPI,LVDS,CAN-FD,BGA,IND TEMP
auf Bestellung 168 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 37.52 EUR |
| 25+ | 31.42 EUR |
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Technische Details SAM9X75D2G-I/4TB Microchip Technology
Description: ARM926 MPU,2GBIT DDR3L,MIPI,LVDS, Packaging: Tray, Package / Case: 243-LFBGA, Mounting Type: Surface Mount, Speed: 800MHz, Operating Temperature: -40°C ~ 85°C (TA), Core Processor: ARM926EJ-S, Voltage - I/O: 1.8V, 2.5V, 3.3V, Supplier Device Package: 243-TFBGA (16x16), Ethernet: 10/100/1000Mbps (1), USB: USB (3), Number of Cores/Bus Width: 1 Core, 32-Bit, RAM Controllers: DDR2, DDR3, DDR3L, SDRAM, Graphics Acceleration: No, Display & Interface Controllers: LCD, LVDS, MIPI/DSI, Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG, Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB.
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| Foto | Bezeichnung | Hersteller | Beschreibung |
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| SAM9X75D2G-I/4TB | Hersteller : Microchip Technology |
System-in-Package MPU |
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SAM9X75D2G-I/4TB | Hersteller : Microchip Technology |
Description: ARM926 MPU,2GBIT DDR3L,MIPI,LVDS Packaging: Tray Package / Case: 243-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 243-TFBGA (16x16) Ethernet: 10/100/1000Mbps (1) USB: USB (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI/DSI Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB |
Produkt ist nicht verfügbar |