Technische Details SDL-108-T-19 Samtec
Description: CONN RCPT 16POS 0.1 GOLD PCB, Number of Rows: 2, Row Spacing - Mating: 0.100" (2.54mm), Insulation Height: 0.083" (2.10mm), Contact Length - Post: 0.082" (2.08mm), Part Status: Active, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 16, Mounting Type: Through Hole, Connector Type: Receptacle, Packaging: Tube.
Weitere Produktangebote SDL-108-T-19 nach Preis ab 9.9 EUR bis 12.5 EUR
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SDL-108-T-19 | Hersteller : Samtec Inc. |
 Description: CONN RCPT 16POS 0.1 GOLD PCBNumber of Rows: 2 Row Spacing - Mating: 0.100" (2.54mm) Insulation Height: 0.083" (2.10mm) Contact Length - Post: 0.082" (2.08mm) Part Status: Active Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 16 Mounting Type: Through Hole Connector Type: Receptacle Packaging: Tube |
auf Bestellung 194 Stücke: Lieferzeit 10-14 Tag (e) |
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