SEAF-30-06.5-S-08-2-A-K-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN HD ARRAY RCPT 240P SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide, Pick and Place
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 240
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Part Status: Active
Number of Rows: 8
| Anzahl | Preis |
|---|---|
| 200+ | 23.76 EUR |
| 400+ | 20.22 EUR |
| 600+ | 18.96 EUR |
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Technische Details SEAF-30-06.5-S-08-2-A-K-TR Samtec Inc.
Description: CONN HD ARRAY RCPT 240P SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Pick and Place, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 240, Pitch: 0.050" (1.27mm), Height Above Board: 0.258" (6.55mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm, Part Status: Active, Number of Rows: 8.
Weitere Produktangebote SEAF-30-06.5-S-08-2-A-K-TR nach Preis ab 22.83 EUR bis 33.48 EUR
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SEAF-30-06.5-S-08-2-A-K-TR | Hersteller : Samtec Inc. |
Description: CONN HD ARRAY RCPT 240P SMD GOLD Packaging: Cut Tape (CT) Features: Board Guide, Pick and Place Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 240 Pitch: 0.050" (1.27mm) Height Above Board: 0.258" (6.55mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm Part Status: Active Number of Rows: 8 |
auf Bestellung 1004 Stücke: Lieferzeit 10-14 Tag (e) |
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SEAF-30-06.5-S-08-2-A-K-TR | Hersteller : Samtec |
Board to Board & Mezzanine Connectors .050" SEARAY(TM) High-Speed High-Density Open-Pin-Field Array Socket |
auf Bestellung 172 Stücke: Lieferzeit 10-14 Tag (e) |
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