SEAF8-30-05.0-S-04-3 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN HD ARRAY RCPT 0.8MM 4X30POS
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 120
Pitch: 0.031" (0.80mm)
Height Above Board: 0.180" (4.57mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 10mm
Number of Rows: 4
auf Bestellung 392 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 27.56 EUR |
| 100+ | 24.99 EUR |
| 250+ | 23.1 EUR |
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Technische Details SEAF8-30-05.0-S-04-3 Samtec Inc.
Description: CONN HD ARRAY RCPT 0.8MM 4X30POS, Packaging: Tape & Reel (TR), Features: Board Guide, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 120, Pitch: 0.031" (0.80mm), Height Above Board: 0.180" (4.57mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 7mm, 10mm, Number of Rows: 4.
Weitere Produktangebote SEAF8-30-05.0-S-04-3 nach Preis ab 23.66 EUR bis 41 EUR
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Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket |
auf Bestellung 211 Stücke: Lieferzeit 14-28 Tag (e) |
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Produkt ist nicht verfügbar |
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SEAF8-30-05.0-S-04-3 | Hersteller : Samtec Inc. |
Description: CONN HD ARRAY RCPT 0.8MM 4X30POS Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 120 Pitch: 0.031" (0.80mm) Height Above Board: 0.180" (4.57mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 10mm Number of Rows: 4 |
Produkt ist nicht verfügbar |