
SEAF8-30-05.0-S-08-3 Samtec Inc.

Description: CONN HD ARRAY RCPT 0.8MM 8X30POS
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 240
Pitch: 0.031" (0.80mm)
Height Above Board: 0.180" (4.57mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 10mm
Part Status: Active
Number of Rows: 8
auf Bestellung 224 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 42.22 EUR |
10+ | 39.96 EUR |
25+ | 38.47 EUR |
50+ | 37.53 EUR |
100+ | 30.62 EUR |
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Technische Details SEAF8-30-05.0-S-08-3 Samtec Inc.
Description: CONN HD ARRAY RCPT 0.8MM 8X30POS, Features: Board Guide, Packaging: Tape & Reel (TR), Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 240, Pitch: 0.031" (0.80mm), Height Above Board: 0.180" (4.57mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 7mm, 10mm, Part Status: Active, Number of Rows: 8.
Weitere Produktangebote SEAF8-30-05.0-S-08-3 nach Preis ab 28.90 EUR bis 43.01 EUR
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SEAF8-30-05.0-S-08-3 | Hersteller : Samtec |
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auf Bestellung 141 Stücke: Lieferzeit 10-14 Tag (e) |
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SEAF8-30-05.0-S-08-3 | Hersteller : Samtec Inc. |
![]() Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 240 Pitch: 0.031" (0.80mm) Height Above Board: 0.180" (4.57mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 10mm Part Status: Active Number of Rows: 8 |
Produkt ist nicht verfügbar |