SEAFP-50-01-L-08-RA-WT-GP Samtec Inc.
Hersteller: Samtec Inc.Description: .050" SEARAY HIGH-SPEED OPEN-PIN
Packaging: Tray
Features: Board Guide, Solder Retention
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle, Press-Fit
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 8
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Technische Details SEAFP-50-01-L-08-RA-WT-GP Samtec Inc.
Description: .050" SEARAY HIGH-SPEED OPEN-PIN, Packaging: Tray, Features: Board Guide, Solder Retention, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Through Hole, Right Angle, Press-Fit, Number of Positions: 400, Pitch: 0.050" (1.27mm), Contact Finish Thickness: 10.0µin (0.25µm), Number of Rows: 8.
Weitere Produktangebote SEAFP-50-01-L-08-RA-WT-GP
| Foto | Bezeichnung | Hersteller | Beschreibung |
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SEAFP-50-01-L-08-RA-WT-GP | Hersteller : Samtec |
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed Open-Pin-Field Array Socket, Press-Fit |
Produkt ist nicht verfügbar |