SEAM8-10-S02.0-S-04-3 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN TERMINAL HS HD ARRAY
Number of Rows: 4
Mated Stacking Heights: 7mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.179" (4.55mm)
Pitch: 0.031" (0.80mm)
Number of Positions: 40
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: High Density Array, Male
Features: Board Guide
Packaging: Strip
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Technische Details SEAM8-10-S02.0-S-04-3 Samtec Inc.
Description: CONN TERMINAL HS HD ARRAY, Number of Rows: 4, Mated Stacking Heights: 7mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.179" (4.55mm), Pitch: 0.031" (0.80mm), Number of Positions: 40, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: High Density Array, Male, Features: Board Guide, Packaging: Strip.
Weitere Produktangebote SEAM8-10-S02.0-S-04-3
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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SEAM8-10-S02.0-S-04-3 | Samtec |
Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SEAM8-10-S02.0-S-04-3 |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Board to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH