SEAMP-20-02.0-L-06 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN HD ARRAY M 120POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details SEAMP-20-02.0-L-06 Samtec Inc.
Description: CONN HD ARRAY M 120POS PRESS-FIT, Packaging: Tray, Connector Type: High Density Array, Male, Contact Finish: Gold, Mounting Type: Through Hole, Number of Positions: 120, Pitch: 0.050" (1.27mm), Height Above Board: 0.181" (4.60mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 7mm, 8mm, 8.5mm, Number of Rows: 6.
Weitere Produktangebote SEAMP-20-02.0-L-06
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
|
SEAMP-20-02.0-L-06 | Hersteller : Samtec Inc. |
Description: CONN HD ARRAY M 120POS PRESS-FIT Packaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
Produkt ist nicht verfügbar |
|
 |
SEAMP-20-02.0-L-06 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit |
Produkt ist nicht verfügbar |