SEAMP-20-02.0-L-08 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN HD ARRAY M 160POS PRESS-FIT
Packaging: Tray
Number of Rows: 8
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.181" (4.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 160
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
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Technische Details SEAMP-20-02.0-L-08 Samtec Inc.
Description: CONN HD ARRAY M 160POS PRESS-FIT, Packaging: Tray, Number of Rows: 8, Mated Stacking Heights: 7mm, 8mm, 8.5mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.181" (4.60mm), Pitch: 0.050" (1.27mm), Number of Positions: 160, Mounting Type: Through Hole, Contact Finish: Gold, Connector Type: High Density Array, Male.
Weitere Produktangebote SEAMP-20-02.0-L-08
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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SEAMP-20-02.0-L-08 | Samtec |
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 80 Stücke Im Einkaufswagen Stück im Wert von UAH |
| SEAMP-20-02.0-L-08 |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit
Produkt ist nicht verfügbar
Mindestbestellmenge: 80 Stücke
Im Einkaufswagen
Stück im Wert von UAH