SEAMP-20-02.0-S-04 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN HD ARRAY M 80POS PRESS-FIT
Number of Rows: 4
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.181" (4.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 80
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Packaging: Tray
Produktrezensionen
Produktbewertung abgeben
Technische Details SEAMP-20-02.0-S-04 Samtec Inc.
Description: CONN HD ARRAY M 80POS PRESS-FIT, Number of Rows: 4, Mated Stacking Heights: 7mm, 8mm, 8.5mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.181" (4.60mm), Pitch: 0.050" (1.27mm), Number of Positions: 80, Mounting Type: Through Hole, Contact Finish: Gold, Connector Type: High Density Array, Male, Packaging: Tray.
Weitere Produktangebote SEAMP-20-02.0-S-04
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
SEAMP-20-02.0-S-04 | Samtec |
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SEAMP-20-02.0-S-04 |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH