SEAMP-20-02.0-S-08-GP Samtec Inc.
Hersteller: Samtec Inc.Description: CONN HD ARRAY M 160POS PRESS-FIT
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
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Technische Details SEAMP-20-02.0-S-08-GP Samtec Inc.
Description: CONN HD ARRAY M 160POS PRESS-FIT, Packaging: Tube, Features: Board Guide, Connector Type: High Density Array, Male, Contact Finish: Gold, Mounting Type: Through Hole, Number of Positions: 160, Pitch: 0.050" (1.27mm), Height Above Board: 0.181" (4.60mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 7mm, 8mm, 8.5mm, Number of Rows: 8.
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SEAMP-20-02.0-S-08-GP | Hersteller : Samtec |
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit |
Produkt ist nicht verfügbar |