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SEAMP-20-02.0-S-08-GP

SEAMP-20-02.0-S-08-GP Samtec

seamp.pdf
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
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Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+32.68 EUR
10+30.94 EUR
26+30.43 EUR
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Technische Details SEAMP-20-02.0-S-08-GP Samtec

Description: CONN HD ARRAY M 160POS PRESS-FIT, Pitch: 0.050" (1.27mm), Number of Positions: 160, Mounting Type: Through Hole, Contact Finish: Gold, Connector Type: High Density Array, Male, Features: Board Guide, Packaging: Tube, Mated Stacking Heights: 7mm, 8mm, 8.5mm, Contact Finish Thickness: 30.0µin (0.76µm), Number of Rows: 8, Height Above Board: 0.181" (4.60mm).

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SEAMP-20-02.0-S-08-GP SEAMP-20-02.0-S-08-GP Samtec Inc. seamp.pdf Description: CONN HD ARRAY M 160POS PRESS-FIT
Pitch: 0.050" (1.27mm)
Number of Positions: 160
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Features: Board Guide
Packaging: Tube
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 8
Height Above Board: 0.181" (4.60mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SEAMP-20-02.0-S-08-GP seamp.pdf
SEAMP-20-02.0-S-08-GP
Hersteller: Samtec Inc.
Description: CONN HD ARRAY M 160POS PRESS-FIT
Pitch: 0.050" (1.27mm)
Number of Positions: 160
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Features: Board Guide
Packaging: Tube
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 8
Height Above Board: 0.181" (4.60mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH