SEAMP-20-02.0-S-08-GP Samtec
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
| Anzahl | Privatkunde |
|---|---|
| 1+ | 43.77 EUR |
| 26+ | 39.14 EUR |
| 52+ | 38.7 EUR |
| 104+ | 36.21 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details SEAMP-20-02.0-S-08-GP Samtec
Description: CONN HD ARRAY M 160POS PRESS-FIT, Features: Board Guide, Packaging: Tube, Connector Type: High Density Array, Male, Contact Finish: Gold, Mounting Type: Through Hole, Number of Positions: 160, Pitch: 0.050" (1.27mm), Height Above Board: 0.181" (4.60mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 7mm, 8mm, 8.5mm, Number of Rows: 8.
Weitere Produktangebote SEAMP-20-02.0-S-08-GP
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
SEAMP-20-02.0-S-08-GP | Samtec Inc. |
Description: CONN HD ARRAY M 160POS PRESS-FITFeatures: Board Guide Packaging: Tube Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 160 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SEAMP-20-02.0-S-08-GP |
![]() |
Hersteller: Samtec Inc.
Description: CONN HD ARRAY M 160POS PRESS-FIT
Features: Board Guide
Packaging: Tube
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Description: CONN HD ARRAY M 160POS PRESS-FIT
Features: Board Guide
Packaging: Tube
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH


