Technische Details SEM-110-02-03.0-H-D-WT Samtec
Description: CONN RCPT 20POS 0.031 GOLD SMD, Features: Solder Retention, Packaging: Tray, Connector Type: Receptacle, Current Rating (Amps): 2.6A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Mated Stacking Heights: 6mm, 7mm, 10mm, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Insulation Height: 0.177" (4.50mm), Row Spacing - Mating: 0.125" (3.18mm), Number of Rows: 2.
Weitere Produktangebote SEM-110-02-03.0-H-D-WT nach Preis ab 8.9 EUR bis 13.74 EUR
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SEM-110-02-03.0-H-D-WT | Samtec |
 Board to Board & Mezzanine Connectors Micro Tiger Eye Socket Strip, 0.80 mm pitch |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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| SEM-110-02-03.0-H-D-WT |
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Hersteller: Samtec
Board to Board & Mezzanine Connectors Micro Tiger Eye Socket Strip, 0.80 mm pitch
Board to Board & Mezzanine Connectors Micro Tiger Eye Socket Strip, 0.80 mm pitch
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 13.74 EUR |
| 10+ | 12.7 EUR |
| 25+ | 12 EUR |
| 50+ | 11.57 EUR |
| 108+ | 9.13 EUR |
| 540+ | 8.9 EUR |