SF-0603HI350M-2 Bourns Inc.
Hersteller: Bourns Inc.
Description: FUSE BOARD MOUNT 3.5A 32VDC 0603
Packaging: Cut Tape (CT)
Package / Case: 0603 (1608 Metric)
Size / Dimension: 0.063" L x 0.031" W x 0.031" H (1.60mm x 0.80mm x 0.80mm)
Fuse Type: Board Mount (Cartridge Style Excluded)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Approval Agency: UL
Breaking Capacity @ Rated Voltage: 50A
Current Rating (Amps): 3.5 A
Voltage Rating - DC: 32 V
Melting I²t: 1.1
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Technische Details SF-0603HI350M-2 Bourns Inc.
Description: FUSE BOARD MOUNT 3.5A 32VDC 0603, Packaging: Tape & Reel (TR), Package / Case: 0603 (1608 Metric), Size / Dimension: 0.063" L x 0.031" W x 0.031" H (1.60mm x 0.80mm x 0.80mm), Fuse Type: Board Mount (Cartridge Style Excluded), Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 150°C, Approval Agency: UL, Breaking Capacity @ Rated Voltage: 50A, Current Rating (Amps): 3.5 A, Voltage Rating - DC: 32 V, Melting I²t: 1.1.
Weitere Produktangebote SF-0603HI350M-2 nach Preis ab 0.54 EUR bis 0.82 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SF-0603HI350M-2 | Bourns |
Fuse Chip 3.5A 32V SMD Solder Pad 0603 Ceramic T/R |
auf Bestellung 4000 Stücke: Lieferzeit 14-21 Tag (e) |
|
| SF-0603HI350M-2 |
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Hersteller: Bourns
Fuse Chip 3.5A 32V SMD Solder Pad 0603 Ceramic T/R
Fuse Chip 3.5A 32V SMD Solder Pad 0603 Ceramic T/R
auf Bestellung 4000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 216+ | 0.82 EUR |
| 221+ | 0.77 EUR |
| 223+ | 0.74 EUR |
| 233+ | 0.68 EUR |
| 247+ | 0.61 EUR |
| 250+ | 0.58 EUR |
| 500+ | 0.55 EUR |
| 1000+ | 0.54 EUR |

