SGM50MDS300000/AA Amphenol Positronic
Hersteller: Amphenol Positronic
Description: SGM50MDS300000/AA
Number of Columns: 13
Contact Finish Thickness: 15.0µin (0.38µm)
Connector Style: High Density (HDC, HDI, HPC)
Connector Usage: Backplane
Termination: Solder
Number of Positions Loaded: All
Number of Rows: 4
Pitch: 0.094" (2.39mm)
Number of Positions: 50
Mounting Type: Through Hole
Color: Gray
Contact Finish: Gold
Connector Type: Plug, Male Pins
Packaging: Bulk
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Technische Details SGM50MDS300000/AA Amphenol Positronic
Description: SGM50MDS300000/AA, Number of Columns: 13, Contact Finish Thickness: 15.0µin (0.38µm), Connector Style: High Density (HDC, HDI, HPC), Connector Usage: Backplane, Termination: Solder, Number of Positions Loaded: All, Number of Rows: 4, Pitch: 0.094" (2.39mm), Number of Positions: 50, Mounting Type: Through Hole, Color: Gray, Contact Finish: Gold, Connector Type: Plug, Male Pins, Packaging: Bulk.
Weitere Produktangebote SGM50MDS300000/AA
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| SGM50MDS300000/AA | Hersteller : Amphenol Positronic |
 Rectangular Mil Spec Connectors |
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