SIDC08D60C6Y Infineon Technologies

Description: DIODE GP 600V 30A WAFER, Mounting Type: Surface Mount, Package / Case: Die, Packaging: Bulk, Operating Temperature - Junction: -40°C ~ 175°C, Supplier Device Package: Sawn on foil, Current - Average Rectified (Io): 30A, Technology: Standard, Speed: Standard Recovery >500ns, > 200mA (Io), Current - Reverse Leakage @ Vr: 27 µA @ 600 V, Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 30 A, Voltage - DC Reverse (Vr) (Max): 600 V, Part Status: Discontinued at Digi-Key.