Technische Details SMD-SC-SN50PB50-0.031-1oz Chip Quik
Description: SN50/PB50 .031" SOLDER WIRE 1OZ, Shelf Life: 60 Months, Shelf Life Start: Date of Manufacture, Process: Leaded, Form: Spool, 1 oz (28.35g), Melting Point: 361°F ~ 414°F (183°C ~ 212°C), Type: Wire Solder, Composition: Sn50Pb50 (50/50), Diameter: 0.031" (0.79mm), Packaging: Bulk.
Weitere Produktangebote SMD-SC-SN50PB50-0.031-1oz nach Preis ab 19.41 EUR bis 24 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SMD-SC-SN50PB50-0.031-1oz | Chip Quik Inc. |
 Description: SN50/PB50 .031" SOLDER WIRE 1OZShelf Life: 60 Months Shelf Life Start: Date of Manufacture Process: Leaded Form: Spool, 1 oz (28.35g) Melting Point: 361°F ~ 414°F (183°C ~ 212°C) Type: Wire Solder Composition: Sn50Pb50 (50/50) Diameter: 0.031" (0.79mm) Packaging: Bulk |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
|
| SMD-SC-SN50PB50-0.031-1oz |
|
Hersteller: Chip Quik Inc.
Description: SN50/PB50 .031" SOLDER WIRE 1OZ
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Process: Leaded
Form: Spool, 1 oz (28.35g)
Melting Point: 361°F ~ 414°F (183°C ~ 212°C)
Type: Wire Solder
Composition: Sn50Pb50 (50/50)
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Description: SN50/PB50 .031" SOLDER WIRE 1OZ
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Process: Leaded
Form: Spool, 1 oz (28.35g)
Melting Point: 361°F ~ 414°F (183°C ~ 212°C)
Type: Wire Solder
Composition: Sn50Pb50 (50/50)
Diameter: 0.031" (0.79mm)
Packaging: Bulk
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 24 EUR |
| 5+ | 20.69 EUR |
| 10+ | 19.41 EUR |