SMD2020 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.010" (0.25mm)
Packaging: Bulk
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Technische Details SMD2020 Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0., Shelf Life: 24 Months, Shelf Life Start: Date of Manufacture, Part Status: Active, Process: Lead Free, Form: Jar, Melting Point: 423 ~ 428°F (217 ~ 220°C), Type: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.010" (0.25mm), Packaging: Bulk.
Weitere Produktangebote SMD2020
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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SMD2020 | Hersteller : Chip Quik |
Solder Lead Free Solder Spheres for BGA's, .010in (0.25mm) Diameter |
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