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Technische Details SMD291AX10T5 Chip Quik
Description: SOLDER PASTE NO CLEAN T5 10CC, Shelf Life: 12 Months, Shelf Life Start: Date of Manufacture, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Part Status: Active, Flux Type: No-Clean, Process: Leaded, Mesh Type: 5, Form: Syringe, 1.23 oz (35g), 10cc, Melting Point: 361°F (183°C), Type: Solder Paste, Composition: Sn63Pb37 (63/37), Packaging: Syringe.
Weitere Produktangebote SMD291AX10T5 nach Preis ab 59.38 EUR bis 59.38 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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SMD291AX10T5 | Chip Quik Inc. |
 Description: SOLDER PASTE NO CLEAN T5 10CCShelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Part Status: Active Flux Type: No-Clean Process: Leaded Mesh Type: 5 Form: Syringe, 1.23 oz (35g), 10cc Melting Point: 361°F (183°C) Type: Solder Paste Composition: Sn63Pb37 (63/37) Packaging: Syringe |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
|
| SMD291AX10T5 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN T5 10CC
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Mesh Type: 5
Form: Syringe, 1.23 oz (35g), 10cc
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Syringe
Description: SOLDER PASTE NO CLEAN T5 10CC
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Mesh Type: 5
Form: Syringe, 1.23 oz (35g), 10cc
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Syringe
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 59.38 EUR |