Technische Details SMD291AX250T3 Chip Quik
Description: SOLDER PASTE SN63/PB37 250G, Packaging: Bulk, Composition: Sn63Pb37 (63/37), Type: Solder Paste, Melting Point: 361°F (183°C), Form: Jar, 8.8 oz (250g), Mesh Type: 3, Process: Leaded, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 12 Months.
Weitere Produktangebote SMD291AX250T3 nach Preis ab 75.27 EUR bis 75.27 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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SMD291AX250T3 | Chip Quik Inc. |
 Description: SOLDER PASTE SN63/PB37 250GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 86 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMD291AX250T3 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 86 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 75.27 EUR |