Technische Details SMD2SW.031 .7OZ Chip Quik
Description: SOLDER WIRE POCKET PACK 60/40 TI, Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 21 SWG, Composition: Sn60Pb40 (60/40), Type: Wire Solder, Melting Point: 361 ~ 370°F (183 ~ 188°C), Form: Tube, 0.7 oz (19.85g), Process: Leaded, Flux Type: No-Clean, Water Soluble, Part Status: Active, Shelf Life: 60 Months.
Weitere Produktangebote SMD2SW.031 .7OZ nach Preis ab 8.25 EUR bis 8.25 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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SMD2SW.031 .7OZ | Chip Quik Inc. |
 Description: SOLDER WIRE POCKET PACK 60/40 TIPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Shelf Life: 60 Months |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMD2SW.031 .7OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.25 EUR |