Technische Details SMD2SWLF.012 100G Chip Quik
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP, Packaging: Bulk, Diameter: 0.012" (0.31mm), Wire Gauge: 28 AWG, 30 SWG, Composition: Sn99.3Cu0.7 (99.3/0.7), Type: Wire Solder, Melting Point: 441°F (227°C), Form: Spool, 3.53 oz (100g), Process: Lead Free, Flux Type: No-Clean, Water Soluble, Part Status: Active.
Weitere Produktangebote SMD2SWLF.012 100G nach Preis ab 77.49 EUR bis 77.49 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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SMD2SWLF.012 100G | Chip Quik Inc. |
 Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.012" (0.31mm) Wire Gauge: 28 AWG, 30 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMD2SWLF.012 100G |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Wire Gauge: 28 AWG, 30 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Wire Gauge: 28 AWG, 30 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 77.49 EUR |