Technische Details SMD3SW.015 100G Chip Quik
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL, Packaging: Bulk, Diameter: 0.015" (0.38mm), Wire Gauge: 27 AWG, 28 SWG, Composition: Sn62Pb36Ag2 (62/36/2), Type: Wire Solder, Melting Point: 354°F (179°C), Form: Spool, 3.53 oz (100g), Process: Leaded, Flux Type: No-Clean, Water Soluble, Part Status: Active.
Weitere Produktangebote SMD3SW.015 100G nach Preis ab 47.71 EUR bis 47.71 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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SMD3SW.015 100G | Chip Quik Inc. |
 Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMD3SW.015 100G |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 47.71 EUR |