Produktrezensionen
Produktbewertung abgeben
Technische Details SMD4300AX250T3 Chip Quik
Description: SOLDER PASTE SN63/PB37 250G, Shelf Life: 12 Months, Shelf Life Start: Date of Manufacture, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Part Status: Active, Flux Type: No-Clean, Water Soluble, Process: Leaded, Mesh Type: 3, Form: Jar, 8.8 oz (250g), Melting Point: 361°F (183°C), Type: Solder Paste, Composition: Sn63Pb37 (63/37), Packaging: Bulk.
Weitere Produktangebote SMD4300AX250T3 nach Preis ab 79.09 EUR bis 79.09 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
 |
SMD4300AX250T3 | Chip Quik Inc. |
 Description: SOLDER PASTE SN63/PB37 250GShelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Part Status: Active Flux Type: No-Clean, Water Soluble Process: Leaded Mesh Type: 3 Form: Jar, 8.8 oz (250g) Melting Point: 361°F (183°C) Type: Solder Paste Composition: Sn63Pb37 (63/37) Packaging: Bulk |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
|
| SMD4300AX250T3 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Leaded
Mesh Type: 3
Form: Jar, 8.8 oz (250g)
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
Description: SOLDER PASTE SN63/PB37 250G
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Leaded
Mesh Type: 3
Form: Jar, 8.8 oz (250g)
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 79.09 EUR |