SMDB03Ce3/TR7 Microchip Technology
Hersteller: Microchip TechnologyDescription: TVS DIODE 3.3VWM 9VC 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 300pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V
Supplier Device Package: 8-SOIC
Bidirectional Channels: 4
Voltage - Breakdown (Min): 4V
Voltage - Clamping (Max) @ Ipp: 9V
Power - Peak Pulse: 300W
Power Line Protection: No
auf Bestellung 392 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.33 EUR |
| 25+ | 3.10 EUR |
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Technische Details SMDB03Ce3/TR7 Microchip Technology
Description: TVS DIODE 3.3VWM 9VC 8-SO, Packaging: Tape & Reel (TR), Package / Case: 8-SOIC (0.154", 3.90mm Width), Mounting Type: Surface Mount, Type: Zener, Operating Temperature: -55°C ~ 150°C (TJ), Applications: General Purpose, Capacitance @ Frequency: 300pF @ 1MHz, Current - Peak Pulse (10/1000µs): 5A (8/20µs), Voltage - Reverse Standoff (Typ): 3.3V, Supplier Device Package: 8-SOIC, Bidirectional Channels: 4, Voltage - Breakdown (Min): 4V, Voltage - Clamping (Max) @ Ipp: 9V, Power - Peak Pulse: 300W, Power Line Protection: No.
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SMDB03Ce3/TR7 | Hersteller : Microchip Technology |
Description: TVS DIODE 3.3VWM 9VC 8-SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 150°C (TJ) Applications: General Purpose Capacitance @ Frequency: 300pF @ 1MHz Current - Peak Pulse (10/1000µs): 5A (8/20µs) Voltage - Reverse Standoff (Typ): 3.3V Supplier Device Package: 8-SOIC Bidirectional Channels: 4 Voltage - Breakdown (Min): 4V Voltage - Clamping (Max) @ Ipp: 9V Power - Peak Pulse: 300W Power Line Protection: No |
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SMDB03Ce3/TR7 | Hersteller : Microchip Technology |
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