SMDLTLFP10T5 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE LOW TEMP LF T5 10CC
Packaging: Dispenser
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
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Technische Details SMDLTLFP10T5 Chip Quik Inc.
Description: SOLDER PASTE LOW TEMP LF T5 10CC, Packaging: Dispenser, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Type: Solder Paste, Melting Point: 281°F (138°C), Form: Syringe, 1.23 oz (35g), 10cc, Mesh Type: 5, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.
Weitere Produktangebote SMDLTLFP10T5
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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SMDLTLFP10T5 | Hersteller : Chip Quik |
Solder SODR PASTE LF (T5) LOW TEMP 10cc SYRNG |
Produkt ist nicht verfügbar |