Technische Details SMDLTLFP50T6 Chip Quik
Description: SOLDER PASTE IN JAR 50G (T6) SN4, Packaging: Bulk, Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4), Type: Solder Paste, Melting Point: 280°F (138°C), Form: Jar, 1.76 oz (50g), Process: Lead Free, Flux Type: No-Clean, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.
Weitere Produktangebote SMDLTLFP50T6 nach Preis ab 236.45 EUR bis 236.45 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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SMDLTLFP50T6 | Chip Quik Inc. |
 Description: SOLDER PASTE IN JAR 50G (T6) SN4Packaging: Bulk Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 1.76 oz (50g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMDLTLFP50T6 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE IN JAR 50G (T6) SN4
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE IN JAR 50G (T6) SN4
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 236.45 EUR |