SMDSN60BI40 Chip Quik
Hersteller: Chip Quik
Solder Tin/Bismuth Solder Wire (Sn60/Bi40) 0.031" diameter - 10 ft with 2cc of SMD291 flux
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Technische Details SMDSN60BI40 Chip Quik
Description: TIN/BISMUTH SOLDER WIRE (SN60/BI, Shelf Life: 60 Months, Shelf Life Start: Date of Manufacture, Part Status: Active, Process: Lead Free, Form: Spool, Melting Point: 280°F ~ 338°F (138°C ~ 170°C), Type: Wire Solder, Diameter: 0.031" (0.79mm), Packaging: Bulk, Composition: Sn60Bi40 (60/40).
Weitere Produktangebote SMDSN60BI40 nach Preis ab 36.08 EUR bis 36.08 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
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SMDSN60BI40 | Chip Quik Inc. |
Description: TIN/BISMUTH SOLDER WIRE (SN60/BI Shelf Life: 60 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Lead Free Form: Spool Melting Point: 280°F ~ 338°F (138°C ~ 170°C) Type: Wire Solder Diameter: 0.031" (0.79mm) Packaging: Bulk Composition: Sn60Bi40 (60/40) |
auf Bestellung 53 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMDSN60BI40 |
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Hersteller: Chip Quik Inc.
Description: TIN/BISMUTH SOLDER WIRE (SN60/BI
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Spool
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Type: Wire Solder
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Composition: Sn60Bi40 (60/40)
Description: TIN/BISMUTH SOLDER WIRE (SN60/BI
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Spool
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Type: Wire Solder
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Composition: Sn60Bi40 (60/40)
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 36.08 EUR |