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Technische Details SMDSW.020 4oz Chip Quik
Description: SOLDER WIRE NO-CLEAN 63/37 4OZ., Packaging: Spool, Diameter: 0.020" (0.51mm), Wire Gauge: 24 AWG, 25 SWG, Composition: Sn63Pb37 (63/37), Type: Wire Solder, Melting Point: 361°F (183°C), Form: Spool, 4 oz (113.40g), Process: Leaded, Flux Type: No-Clean, Water Soluble, Part Status: Active.
Weitere Produktangebote SMDSW.020 4oz nach Preis ab 31.25 EUR bis 31.25 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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SMDSW.020 4oz | Chip Quik Inc. |
 Description: SOLDER WIRE NO-CLEAN 63/37 4OZ.Packaging: Spool Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 109 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMDSW.020 4oz |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE NO-CLEAN 63/37 4OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE NO-CLEAN 63/37 4OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 109 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.25 EUR |