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Technische Details SMDSWLF.020 1oz Chip Quik
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ., Flux Type: No-Clean, Water Soluble, Process: Lead Free, Form: Spool, 1 oz (28.35g), Melting Point: 423 ~ 428°F (217 ~ 220°C), Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Wire Gauge: 24 AWG, 25 SWG, Diameter: 0.020" (0.51mm), Packaging: Spool, Part Status: Active.
Weitere Produktangebote SMDSWLF.020 1oz nach Preis ab 21.13 EUR bis 21.13 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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SMDSWLF.020 1oz | Chip Quik Inc. |
 Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 1 oz (28.35g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 24 AWG, 25 SWG Diameter: 0.020" (0.51mm) Packaging: Spool Part Status: Active |
auf Bestellung 157 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMDSWLF.020 1oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 oz (28.35g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Spool
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 oz (28.35g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Spool
Part Status: Active
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.13 EUR |