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Technische Details SMDSWLF.031 8OZ Chip Quik
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI, Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 22 SWG, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Wire Solder, Melting Point: 423 ~ 428°F (217 ~ 220°C), Form: Spool, 8 oz (227g), 1/2 lb, Process: Lead Free, Flux Type: No-Clean, Water Soluble, Part Status: Active.
Weitere Produktangebote SMDSWLF.031 8OZ nach Preis ab 117.43 EUR bis 117.43 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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SMDSWLF.031 8OZ | Chip Quik Inc. |
 Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMDSWLF.031 8OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 117.43 EUR |