SMT3UT BusBoard Prototype Systems
Hersteller: BusBoard Prototype Systems
Description: 200X100MIL PADS, 1/32" THIN
Packaging: Bag
Size / Dimension: 6.30" L x 3.90" W (160.0mm x 99.1mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Breadboard, Surface Mount
Hole Diameter: 0.031" (0.79mm)
Circuit Pattern: Pad Per Hole (Rectangular)
Plating: Non-Plated Through Hole (NPTH)
Produktrezensionen
Produktbewertung abgeben
Technische Details SMT3UT BusBoard Prototype Systems
Description: 200X100MIL PADS, 1/32" THIN, Packaging: Bag, Size / Dimension: 6.30" L x 3.90" W (160.0mm x 99.1mm), Pitch: 0.100" (2.54mm), Board Thickness: 0.031" (0.79mm) 1/32", Proto Board Type: Breadboard, Surface Mount, Hole Diameter: 0.031" (0.79mm), Circuit Pattern: Pad Per Hole (Rectangular), Plating: Non-Plated Through Hole (NPTH).
Weitere Produktangebote SMT3UT nach Preis ab 24.06 EUR bis 25.33 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SMT3UT | Hersteller : BusBoard Prototype Systems |
PCBs & Breadboards SMTboard-3U-Thin 2sides Unplatd Holes |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
|