SP2000-0.015-00-62 Bergquist
Hersteller: Bergquist
Description: THERM PAD 19.05MMX15.24MM WHT
Backing, Carrier: Fiberglass
Thermal Conductivity: 3.5W/m-K
Outline: 19.05mm x 15.24mm
Usage: TO-220
Thermal Resistivity: 0.33°C/W
Type: Pad, Sheet
Thickness: 0.0150" (0.381mm)
Shape: Rectangular
Material: Silicone Elastomer
Color: White
Packaging: Bulk
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Technische Details SP2000-0.015-00-62 Bergquist
Description: THERM PAD 19.05MMX15.24MM WHT, Backing, Carrier: Fiberglass, Thermal Conductivity: 3.5W/m-K, Outline: 19.05mm x 15.24mm, Usage: TO-220, Thermal Resistivity: 0.33°C/W, Type: Pad, Sheet, Thickness: 0.0150" (0.381mm), Shape: Rectangular, Material: Silicone Elastomer, Color: White, Packaging: Bulk.
Weitere Produktangebote SP2000-0.015-00-62
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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SP2000-0.015-00-62 | Hersteller : Bergquist Company |
Thermal Interface Products High Reliability Insulator, 0.015" Thickness, Sil-Pad TSP3500/2000, IDH 2167626 |
Produkt ist nicht verfügbar |