SP900S-0.009-00-12 Bergquist
Hersteller: Bergquist
Description: THERM PAD 6.35MM DIA PINK
Backing, Carrier: Fiberglass
Thermal Conductivity: 1.6W/m-K
Outline: 6.35mm Dia
Usage: TO-18
Thermal Resistivity: 0.61°C/W
Type: Pad, Sheet
Thickness: 0.0090" (0.229mm)
Shape: Round
Material: Silicone Rubber
Color: Pink
Packaging: Bulk
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Technische Details SP900S-0.009-00-12 Bergquist
Description: THERM PAD 6.35MM DIA PINK, Backing, Carrier: Fiberglass, Thermal Conductivity: 1.6W/m-K, Outline: 6.35mm Dia, Usage: TO-18, Thermal Resistivity: 0.61°C/W, Type: Pad, Sheet, Thickness: 0.0090" (0.229mm), Shape: Round, Material: Silicone Rubber, Color: Pink, Packaging: Bulk.
Weitere Produktangebote SP900S-0.009-00-12
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
SP900S-0.009-00-12 | Bergquist Company |
Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, Sil-Pad TSP 1600S Series / Also Known as Bergquist Sil-Pad 900S Series |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4200 Stücke Im Einkaufswagen Stück im Wert von UAH |
| SP900S-0.009-00-12 |
|
Hersteller: Bergquist Company
Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, Sil-Pad TSP 1600S Series / Also Known as Bergquist Sil-Pad 900S Series
Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, Sil-Pad TSP 1600S Series / Also Known as Bergquist Sil-Pad 900S Series
Produkt ist nicht verfügbar
Mindestbestellmenge: 4200 Stücke
Im Einkaufswagen
Stück im Wert von UAH