SSW-113-06-G-D Samtec
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 6.07 EUR |
| 25+ | 5.91 EUR |
| 50+ | 5.79 EUR |
| 100+ | 5.53 EUR |
| 500+ | 5.09 EUR |
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Technische Details SSW-113-06-G-D Samtec
Description: CONN RCPT 26POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Receptacle, Current Rating (Amps): 4.7A per Contact, Mounting Type: Through Hole, Number of Positions: 26, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Gold, Contact Length - Post: 0.124" (3.15mm), Insulation Height: 0.335" (8.51mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote SSW-113-06-G-D nach Preis ab 4.94 EUR bis 6.12 EUR
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SSW-113-06-G-D | Hersteller : Samtec Inc. |
 Description: CONN RCPT 26POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Receptacle Current Rating (Amps): 4.7A per Contact Mounting Type: Through Hole Number of Positions: 26 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Gold Contact Length - Post: 0.124" (3.15mm) Insulation Height: 0.335" (8.51mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 521 Stücke: Lieferzeit 10-14 Tag (e) |
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