
SSW-130-01-F-D Samtec
auf Bestellung 481 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 12.37 EUR |
10+ | 10.96 EUR |
25+ | 9.20 EUR |
100+ | 8.75 EUR |
500+ | 8.64 EUR |
1000+ | 8.32 EUR |
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Technische Details SSW-130-01-F-D Samtec
Description: CONN RCPT 60POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Receptacle, Current Rating (Amps): 4.7A per Contact, Mounting Type: Through Hole, Number of Positions: 60, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.104" (2.64mm), Insulation Height: 0.335" (8.51mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote SSW-130-01-F-D nach Preis ab 10.77 EUR bis 15.98 EUR
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SSW-130-01-F-D | Hersteller : Samtec Inc. |
Description: CONN RCPT 60POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 4.7A per Contact Mounting Type: Through Hole Number of Positions: 60 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.104" (2.64mm) Insulation Height: 0.335" (8.51mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 609 Stücke: Lieferzeit 10-14 Tag (e) |
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