STGIB30M60S-XZ STMicroelectronics
Hersteller: STMicroelectronics
Description: DISCRETE
Packaging: Bulk
Package / Case: 26-PowerDIP Module (1.146", 29.10mm)
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 1600Vrms
Current: 35 A
Voltage: 600 V
Description: DISCRETE
Packaging: Bulk
Package / Case: 26-PowerDIP Module (1.146", 29.10mm)
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 1600Vrms
Current: 35 A
Voltage: 600 V
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Technische Details STGIB30M60S-XZ STMicroelectronics
Description: DISCRETE, Packaging: Bulk, Package / Case: 26-PowerDIP Module (1.146", 29.10mm), Mounting Type: Through Hole, Type: IGBT, Configuration: 3 Phase Inverter, Voltage - Isolation: 1600Vrms, Current: 35 A, Voltage: 600 V.
Weitere Produktangebote STGIB30M60S-XZ
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| STGIB30M60S-XZ | Hersteller : STMicroelectronics |
 IGBT Modules SLLIMM 2nd series IPM, 3-phase inverter, 35 A, 600 V short-circuit rugged IGBTs |
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