SU1210000000G Amphenol Anytek

Description: SU-2*6P BLACK ; 10.0MM CLIP PLA, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: FLASH, Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Brass, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Termination: Solder, Number of Positions or Pins (Grid): 12 (2 x 6), Operating Temperature: -40°C ~ 105°C, Type: DIP, 0.1" (2.54mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.