T1M-04-GF-DH Samtec

Description: CONN HEADER SMD R/A 8POS 1MM, Row Spacing - Mating: 0.077" (1.96mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.246" (6.25mm), Contact Shape: Square, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.039" (1.00mm), Insulation Color: Natural, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Locking Ramp, Contact Type: Male Pin, Operating Temperature: -55°C ~ 85°C, Style: Board to Cable/Wire, Number of Rows: 2, Number of Positions: 8, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 250VAC, 353VDC, Connector Type: Header, Packaging: Tape & Reel (TR).