
T1M-10-GF-DV-K Samtec Inc.

Description: CONN HEADER SMD 20POS 1MM
Packaging: Cut Tape (CT)
Features: Pick and Place
Connector Type: Header
Voltage Rating: 250VAC, 353VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 85°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.268" (6.80mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.077" (1.96mm)
auf Bestellung 227 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
3+ | 7.57 EUR |
25+ | 6.84 EUR |
50+ | 6.35 EUR |
100+ | 6.05 EUR |
Produktrezensionen
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Technische Details T1M-10-GF-DV-K Samtec Inc.
Description: CONN HEADER SMD 20POS 1MM, Features: Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 250VAC, 353VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 85°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Gold, Contact Shape: Square, Insulation Height: 0.268" (6.80mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.077" (1.96mm).
Weitere Produktangebote T1M-10-GF-DV-K
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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T1M-10-GF-DV-K | Hersteller : Samtec |
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auf Bestellung 12 Stücke: Lieferzeit 14-21 Tag (e) |
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T1M-10-GF-DV-K | Hersteller : SAMTEC |
![]() tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Steckverbindertyp: PCB-Stiftleiste Produktpalette: T1M productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (21-Jan-2025) |
auf Bestellung 31 Stücke: Lieferzeit 14-21 Tag (e) |
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T1M-10-GF-DV-K | Hersteller : Samtec |
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auf Bestellung 119 Stücke: Lieferzeit 10-14 Tag (e) |
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T1M-10-GF-DV-K | Hersteller : Samtec Inc. |
![]() Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 250VAC, 353VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 85°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Gold Contact Shape: Square Insulation Height: 0.268" (6.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.077" (1.96mm) |
Produkt ist nicht verfügbar |