auf Bestellung 1581 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 5.7 EUR |
| 25+ | 5.4 EUR |
| 50+ | 5.16 EUR |
| 100+ | 4.05 EUR |
| 425+ | 3.7 EUR |
| 850+ | 3.29 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details T1M-10-GF-DV Samtec
Description: CONN HEADER SMD 20POS 1MM, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 250VAC, 353VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 85°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Gold, Part Status: Active, Contact Shape: Square, Insulation Height: 0.268" (6.80mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.077" (1.96mm).
Weitere Produktangebote T1M-10-GF-DV nach Preis ab 7.86 EUR bis 11.09 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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T1M-10-GF-DV | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 20POS 1MMPackaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 250VAC, 353VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 85°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Insulation Height: 0.268" (6.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.077" (1.96mm) |
auf Bestellung 849 Stücke: Lieferzeit 10-14 Tag (e) |
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T1M-10-GF-DV | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 20POS 1MMPackaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 250VAC, 353VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 85°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Insulation Height: 0.268" (6.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.077" (1.96mm) |
auf Bestellung 904 Stücke: Lieferzeit 10-14 Tag (e) |
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T1M-10-GF-DV | Hersteller : SAMTEC |
Description: SAMTEC - T1M-10-GF-DV - Stiftleiste, Wire-to-Board, 1 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, gerade, T1MtariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: T1M productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (25-Jun-2025) |
auf Bestellung 47 Stücke: Lieferzeit 14-21 Tag (e) |


