T2M-104-01-L-D-SM-WT Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 7.85 EUR |
| 41+ | 5.3 EUR |
| 82+ | 5.18 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details T2M-104-01-L-D-SM-WT Samtec
Description: CONN HEADER SMD 8POS 2MM, Row Spacing - Mating: 0.079" (2.00mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.228" (5.80mm), Contact Shape: Square, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 2, Number of Positions: 8, Mounting Type: Surface Mount, Current Rating (Amps): 3.8A, Connector Type: Header, Features: Solder Retention, Packaging: Tube.
Weitere Produktangebote T2M-104-01-L-D-SM-WT nach Preis ab 6.3 EUR bis 9.12 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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T2M-104-01-L-D-SM-WT | Samtec Inc. |
 Description: CONN HEADER SMD 8POS 2MMRow Spacing - Mating: 0.079" (2.00mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Shrouded - 4 Wall Insulation Height: 0.228" (5.80mm) Contact Shape: Square Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Contact Material: Phosphor Bronze Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Style: Board to Board or Cable Number of Rows: 2 Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 3.8A Connector Type: Header Features: Solder Retention Packaging: Tube |
auf Bestellung 220 Stücke: Lieferzeit 10-14 Tag (e) |
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T2M-104-01-L-D-SM-WT | SAMTEC |
Description: SAMTEC - T2M-104-01-L-D-SM-WT - Stiftleiste, Board-to-Board, Wire-to-Board, 2 mm, 2 Reihe(n), 8 Kontakt(e), Oberflächenmontage tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 8Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board, Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: T2M productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 2mm |
auf Bestellung 86 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| T2M-104-01-L-D-SM-WT |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 8POS 2MM
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.228" (5.80mm)
Contact Shape: Square
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 2
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): 3.8A
Connector Type: Header
Features: Solder Retention
Packaging: Tube
Description: CONN HEADER SMD 8POS 2MM
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.228" (5.80mm)
Contact Shape: Square
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 2
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): 3.8A
Connector Type: Header
Features: Solder Retention
Packaging: Tube
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.12 EUR |
| 50+ | 7.41 EUR |
| 100+ | 6.3 EUR |
| T2M-104-01-L-D-SM-WT |
|
Hersteller: SAMTEC
Description: SAMTEC - T2M-104-01-L-D-SM-WT - Stiftleiste, Board-to-Board, Wire-to-Board, 2 mm, 2 Reihe(n), 8 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board, Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: T2M
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2mm
Description: SAMTEC - T2M-104-01-L-D-SM-WT - Stiftleiste, Board-to-Board, Wire-to-Board, 2 mm, 2 Reihe(n), 8 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board, Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: T2M
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2mm
auf Bestellung 86 Stücke:
Lieferzeit 14-21 Tag (e)