T2M-110-01-L-D-SM-WT Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 9.72 EUR |
| 44+ | 8.79 EUR |
| 110+ | 7.79 EUR |
| 506+ | 7.54 EUR |
Produktrezensionen
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Technische Details T2M-110-01-L-D-SM-WT Samtec
Description: CONN HEADER SMD 20POS 2MM, Features: Solder Retention, Packaging: Tube, Connector Type: Header, Current Rating (Amps): 3.8A, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.228" (5.80mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.079" (2.00mm).
Weitere Produktangebote T2M-110-01-L-D-SM-WT nach Preis ab 5.8 EUR bis 10.42 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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T2M-110-01-L-D-SM-WT | Samtec Inc. |
 Description: CONN HEADER SMD 20POS 2MMFeatures: Solder Retention Packaging: Tube Connector Type: Header Current Rating (Amps): 3.8A Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.228" (5.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.079" (2.00mm) |
auf Bestellung 2384 Stücke: Lieferzeit 10-14 Tag (e) |
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T2M-110-01-L-D-SM-WT | SAMTEC |
Description: SAMTEC - T2M-110-01-L-D-SM-WT - Stiftleiste, Board-to-Board, Wire-to-Board, 2 mm, 2 Reihe(n), 20 Kontakt(e) tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 20Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board, Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: T2M productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 2mm |
auf Bestellung 61 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| T2M-110-01-L-D-SM-WT |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 20POS 2MM
Features: Solder Retention
Packaging: Tube
Connector Type: Header
Current Rating (Amps): 3.8A
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.228" (5.80mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.079" (2.00mm)
Description: CONN HEADER SMD 20POS 2MM
Features: Solder Retention
Packaging: Tube
Connector Type: Header
Current Rating (Amps): 3.8A
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.228" (5.80mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.079" (2.00mm)
auf Bestellung 2384 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.42 EUR |
| 25+ | 9.42 EUR |
| 50+ | 8.77 EUR |
| 100+ | 8.34 EUR |
| 500+ | 6.44 EUR |
| 1000+ | 5.8 EUR |
| T2M-110-01-L-D-SM-WT |
|
Hersteller: SAMTEC
Description: SAMTEC - T2M-110-01-L-D-SM-WT - Stiftleiste, Board-to-Board, Wire-to-Board, 2 mm, 2 Reihe(n), 20 Kontakt(e)
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 20Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board, Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: T2M
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2mm
Description: SAMTEC - T2M-110-01-L-D-SM-WT - Stiftleiste, Board-to-Board, Wire-to-Board, 2 mm, 2 Reihe(n), 20 Kontakt(e)
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 20Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board, Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: T2M
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2mm
auf Bestellung 61 Stücke:
Lieferzeit 14-21 Tag (e)